University of Delhi will organise a Job Mela: Internship and Placement Drive 2026 on 20 March 2026 to connect undergraduate and postgraduate students with prospective recruiters. The event, led by the Central Placement Cell (CPC) under the Office of the Dean Students’ Welfare, aims to strengthen industry‑academia linkages and provide meaningful career opportunities to students across disciplines. Students interested in participating can register for the event through the official registration link by 15 March 2026.
What to Expect at DU Job Mela 2026
The 2026 Job Mela will bring together organisations from a wide range of sectors, allowing students to explore both placements and internship roles. Recruiters will include corporate enterprises, start‑ups, non‑profit organisations, consultancies, research bodies and public sector undertakings. This initiative is designed to help students gain exposure to real‑world job markets, network with industry professionals, and secure career openings aligned with their academic and professional interests
How to Registerat DU Job Mela 2026 ?
Students who wish to participate in the placement and internship drive must register online through the official Google Forms link shared by the CPC. Registration closes on 15 March 2026, and interested students are encouraged to complete this process early to ensure participation.
Purpose of the Job Mela
The CPC’s job mela is part of ongoing efforts to bridge the gap between academics and industry needs. By inviting diverse organisations to campus, Delhi University aims to:
- Provide internship opportunities for early‑year UG and PG students.
- Offer full‑time employment options especially for final‑year students.
- Facilitate industry exposure and professional interaction for all participants.
Last year, DU’s placement events saw participation from dozens of companies and resulted in both internship and job offers for students. This year’s drive is expected to expand on previous outreach by including new recruiters and broader opportunities.